JPH02113341U - - Google Patents
Info
- Publication number
- JPH02113341U JPH02113341U JP2050089U JP2050089U JPH02113341U JP H02113341 U JPH02113341 U JP H02113341U JP 2050089 U JP2050089 U JP 2050089U JP 2050089 U JP2050089 U JP 2050089U JP H02113341 U JPH02113341 U JP H02113341U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- heat
- semiconductor
- shape memory
- dissipates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2050089U JPH02113341U (en]) | 1989-02-25 | 1989-02-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2050089U JPH02113341U (en]) | 1989-02-25 | 1989-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113341U true JPH02113341U (en]) | 1990-09-11 |
Family
ID=31236921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2050089U Pending JPH02113341U (en]) | 1989-02-25 | 1989-02-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113341U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650398U (ja) * | 1992-12-04 | 1994-07-08 | 株式会社村田製作所 | 放熱板 |
| JP2004071658A (ja) * | 2002-08-01 | 2004-03-04 | Nec Corp | チップ部品を備える電子装置及びその製造方法 |
-
1989
- 1989-02-25 JP JP2050089U patent/JPH02113341U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650398U (ja) * | 1992-12-04 | 1994-07-08 | 株式会社村田製作所 | 放熱板 |
| JP2004071658A (ja) * | 2002-08-01 | 2004-03-04 | Nec Corp | チップ部品を備える電子装置及びその製造方法 |